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Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps

Chen, Chun-Jen lin, Kwang-Lung

Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps - 691-697 p.

Subjects--Topical Terms:
Diffusion Barriers
Electroless Nickel Plating
Flip-Chip

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