Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps

By: Material type: ArticleArticleDescription: 691-697 pSubject(s): In: IEEE Transactions on Components and Packaging Technologies
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.24, No.04 (Oct. 2001) Available

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