Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps (Record no. 740335)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 00553nab a2200157Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s2001 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Chen, Chun-Jen |
| 9 (RLIN) | 768421 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | lin, Kwang-Lung |
| 9 (RLIN) | 768422 |
| 245 #0 - TITLE STATEMENT | |
| Title | Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 691-697 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Diffusion Barriers |
| 9 (RLIN) | 768423 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Electroless Nickel Plating |
| 9 (RLIN) | 768424 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Flip-Chip |
| 9 (RLIN) | 765290 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 2001 |
| Title | IEEE Transactions on Components and Packaging Technologies |
| International Standard Serial Number | 15213331 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.24, No.04 (Oct. 2001) | 19/08/2023 | Articles |