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Silicon Wafer Bonding Technology for VLSI and Mems Applications
Material type:
TextLanguage: English Series: Emis Processing Series ; No. 1Publication details: London : Inspec, c2002Description: XXV, 149 p. : illISBN: - 0852960395
- 621.38152 IYE
| Item type | Current library | Shelving location | Call number | Status | Date due | Barcode |
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Lending Collection
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Circulation Section | Circulation Section | 621.38152 IYE | Available | 67826 |