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		Compliant Bumps for Adhesive Flip-Chip Assembly by Keswick, Kathryn German, Randy L Nolan, Rich Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Polyheral Contact for mation Modeling and Identification for Autonomous Complaint Motion by Lefebvre, Tine Bruynincks, Herman Source: Ieee Transactions on Robotics and Automation Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Control of Contact Via Tactile Sensing. by Chen, N. N Zhang, H Source: Ieee Transactions on Robotics and Automation Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Spatial Impedance Controller for Robotic Manipulation. by Broenink, J. F Fasse, E. D Source: Ieee Transactions on Robotics and Automation Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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