Compliant Bumps for Adhesive Flip-Chip Assembly

By: Material type: ArticleArticleDescription: 503-510 pSubject(s): In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.18, No.03 (Aug. 1995) Available

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