Compliant Bumps for Adhesive Flip-Chip Assembly (Record no. 743913)

MARC details
000 -LEADER
fixed length control field 00581nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1995 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Keswick, Kathryn
9 (RLIN) 777355
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name German, Randy L.
9 (RLIN) 777356
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Nolan, Rich
9 (RLIN) 777357
245 #0 - TITLE STATEMENT
Title Compliant Bumps for Adhesive Flip-Chip Assembly
300 ## - PHYSICAL DESCRIPTION
Extent 503-510 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Compliant Motion
9 (RLIN) 777358
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip Chip
9 (RLIN) 765290
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Assembly
9 (RLIN) 777359
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1995
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.18, No.03 (Aug. 1995)   19/08/2023 Articles
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