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		Three-Dimensional Modeling of Mold Fililng in Microelectronics Encapsulation Process by Chang, Rong-Chong Yang, Wen-Hsien Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Multichip Mmic Package for X and Ka Bands by Decker, D. Richard Mysoor, Barayan Rangappa Tatikola, Ramani Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Improving Manufacturing Reliability in Ic Package Assembly Using Fmea Technique by Prasad, Shankara Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Comprehensive Approach for Analysis of Package Induced Stress in Ic'S Using Analytical and Empirical Methods by Pendse, Rajendra D Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermaliy Induced Ic Package Cracking by Suhl, David Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development and Analysis of an Automated Test System for Thermal Characterization of Ic Packaging Technologies by Mathuna, Sean Cian O Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Ic Manufacturing Diagnosis Based on Statistical Analysis Techniques by Kibarian, John K Strojwas, andrzej J Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Method ofMeasurement of Moisture in Ic Packages Using Microwaves by Ju, Yang Abe, Hiroyuki Saka, Masumi Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Measurement of Ic Package Shieldingeffictiveness Using An Integrated Antenna. by Rollin, J. J Roy, L Source: Ieee Transactions on Instrumentation and Measurement Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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