Three-Dimensional Modeling of Mold Fililng in Microelectronics Encapsulation Process

By: Material type: ArticleArticleDescription: 200-209 pSubject(s): In: IEEE Transactions on Components and Packaging Technologies
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.27, No.01 (Mar. 2004) Available

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