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Three-Dimensional Modeling of Mold Fililng in Microelectronics Encapsulation Process

Chang, Rong-Chong Yang, Wen-Hsien

Three-Dimensional Modeling of Mold Fililng in Microelectronics Encapsulation Process - 200-209 p.

Subjects--Topical Terms:
Finite Volume
Ic Packages
Vof

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