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		Bi-Induced Voids AtCu3sn/Cu Interface in Eutectic Snbi/Cu Solder Joints by Shang, P.J Source: Scripta Materialia Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Interfacial Metaliurgical Reaction Between Smali Flip-Chip Sn/Au Bumps and Thin Au/Tiw Metalilzation Under Multiple Reflow by Yu, D.Q Source: Scripta Materialia Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Reliability of Plastic Bali Grid Array Package by Sawada, Yuko Oka, Seiji Yamaguchi, Akihiko Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electricaliy Conductive Adhesives: a Prospective Alternative for Smd Soldering by Jagt, J. C lijten, G. F. C. M Beris, P. J. M Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Interface Reaction Between Ag-Pd Conductor and Pd-Sn Solder by Moriya, Yoichi Shinya, Ryuji Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Wetting Characteristics of Pb-Free Solder Alloys and Pwb Finishes by Dang, J Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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