Interfacial Metaliurgical Reaction Between Smali Flip-Chip Sn/Au Bumps and Thin Au/Tiw Metalilzation Under Multiple Reflow

By: Material type: ArticleArticleDescription: 606-609 pSubject(s): In: Scripta Materialia
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Articles Articles Periodical Section Vol.58, No.07 (Apr. 2008) Available

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