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Interfacial Metaliurgical Reaction Between Smali Flip-Chip Sn/Au Bumps and Thin Au/Tiw Metalilzation Under Multiple Reflow

Yu, D.Q.

Interfacial Metaliurgical Reaction Between Smali Flip-Chip Sn/Au Bumps and Thin Au/Tiw Metalilzation Under Multiple Reflow - 606-609 p.

Subjects--Topical Terms:
Flip Chip
Soldering Error
Intermetalilc Compound

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