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		Microelectronics Packaging Handbook by Tummala, Rao R [editor] Klopfenstein, Alan G [editor] Rymaszewski, Eugene J [editor] Edition: 2nd Material type: Text Language: English Publication details: New York : Chapman and Hall, c1997 Online access: Table of Contents Availability: Items available for loan: Reference Section (1)Location, call number: Reference Section 621.38102 TUM.
		Electronic Packaging In1990s-A Perspective from America by Tummala, Rao R Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cosintering Process for Glass-Ceramic/Copper Multilayer Ceramic Substrate by Master, Raj N Tummala, Rao R Herron, L. Wynn Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Overview of Packaging for Ibm Enterprise System/9000 Based onGlass-Ceramic Copper/Thin Film Thermal Conduction Module by Tummala, Rao R Ahmed, Shakil Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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