Overview of Packaging for Ibm Enterprise System/9000 Based onGlass-Ceramic Copper/Thin Film Thermal Conduction Module

By: Material type: ArticleArticleDescription: 426-431 pSubject(s): In: IEEE Transactions on Components Hybrids and Manufacturing Technology
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.15, No.04 (Aug. 1992) Available

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