Overview of Packaging for Ibm Enterprise System/9000 Based onGlass-Ceramic Copper/Thin Film Thermal Conduction Module (Record no. 750413)

MARC details
000 -LEADER
fixed length control field 00590nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1992 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Tummala, Rao R.
9 (RLIN) 93811
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Ahmed, Shakil
9 (RLIN) 694283
245 #0 - TITLE STATEMENT
Title Overview of Packaging for Ibm Enterprise System/9000 Based onGlass-Ceramic Copper/Thin Film Thermal Conduction Module
300 ## - PHYSICAL DESCRIPTION
Extent 426-431 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Glass Ceramics
9 (RLIN) 52308
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Copper
9 (RLIN) 163065
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Thermal Conduction Modules
9 (RLIN) 788283
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1992
Title IEEE Transactions on Components Hybrids and Manufacturing Technology
International Standard Serial Number 01486411
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.15, No.04 (Aug. 1992)   19/08/2023 Articles
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