High Density Packaging of X-Band Active Array Modules

By: Material type: ArticleArticleDescription: 279-291 pSubject(s): In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.20, No.03 (Aug. 1997) Available

Visit counter For Websites

Copyright © 
Engr Abul Kalam Library, NEDUET, 2024