High Density Packaging of X-Band Active Array Modules (Record no. 744789)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00553nab a2200157Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s1997 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Hauhe, Mark S. |
| 9 (RLIN) | 779478 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Wooldridge, John J. |
| 9 (RLIN) | 779480 |
| 245 #0 - TITLE STATEMENT | |
| Title | High Density Packaging of X-Band Active Array Modules |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 279-291 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Active Area |
| 9 (RLIN) | 734097 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Aluminum Nitride |
| 9 (RLIN) | 738735 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Flip Chip |
| 9 (RLIN) | 765290 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 1997 |
| Title | IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging |
| International Standard Serial Number | 10709894 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.20, No.03 (Aug. 1997) | 19/08/2023 | Articles |