Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading. II. Using Alioy 42 as Leadframe Material

By: Material type: ArticleArticleDescription: 176-183 pSubject(s): In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.20, No.02 (May. 1997) Available

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