Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading. II. Using Alioy 42 as Leadframe Material (Record no. 744349)

MARC details
000 -LEADER
fixed length control field 00640nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1997 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Saitoh, Takehiro
9 (RLIN) 774400
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Toya, Masayuki
9 (RLIN) 778448
245 #0 - TITLE STATEMENT
Title Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading. II. Using Alioy 42 as Leadframe Material
300 ## - PHYSICAL DESCRIPTION
Extent 176-183 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Delamination
9 (RLIN) 170371
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Finite - Element Analysis
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Fracture
9 (RLIN) 162023
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1997
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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  Engr Abul Kalam Library Vol.20, No.02 (May. 1997)   19/08/2023 Articles
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