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		A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density by Lee, Tien-Yu Lee, Taek Jung Tu, King-Ning Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of Multicellular Solutions in Natural Convection Nusselt Numbers for Simultaneous Convection Above and Below A Uni for maly Heated Horizontal Thin Plate. by Lee, Tien-Yu Chambers, B Source: Transactions ofAsme, Journal of Heat Transfer Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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