A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density

By: Material type: ArticleArticleDescription: 472-479 pSubject(s): In: IEEE Transactions on Components and Packaging Technologies
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.27, No.03 (Sep. 2004) Available

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