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A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density

Lee, Tien-Yu Lee, Taek Jung Tu, King-Ning

A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density - 472-479 p.

Subjects--Topical Terms:
Computation Fluid Dynamics
Current Density
Flip-Chip

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