Characteristics and Reliabity of Fast-Flow, Snap-Cure, and Reworkable Underfills for Solder Bumped Flip Chip on Low-Cost Sustrates

By: Material type: ArticleArticleDescription: 231-239 pSubject(s): In: Ieee Transactions onElectronics Packaging Manufacturing
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Articles Articles Periodical Section Vol.25, No.03 (Jul. 2002) Available

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