Characteristics and Reliabity of Fast-Flow, Snap-Cure, and Reworkable Underfills for Solder Bumped Flip Chip on Low-Cost Sustrates (Record no. 771937)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 00463nab a2200121Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s2002 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Lau, K. K |
| 9 (RLIN) | 810681 |
| 245 #0 - TITLE STATEMENT | |
| Title | Characteristics and Reliabity of Fast-Flow, Snap-Cure, and Reworkable Underfills for Solder Bumped Flip Chip on Low-Cost Sustrates |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 231-239 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Reliability |
| 9 (RLIN) | 53955 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 2002 |
| Title | Ieee Transactions onElectronics Packaging Manufacturing |
| International Standard Serial Number | 1523334X |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.25, No.03 (Jul. 2002) | 19/08/2023 | Articles |