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Characterization of Integrated Circuit Packaging Materials

By: Contributor(s): Material type: TextTextLanguage: English Series: Materials Characterization SeriesPublication details: Boston : Butterworth-Heinemann, c1993Description: XVIII, 274 pISBN:
  • 0750692677
Subject(s): DDC classification:
  • 621.381046 MOO
Online resources:
Holdings
Item type Current library Shelving location Call number Status Date due Barcode
Lending Collection Lending Collection Circulation Section Circulation Section 621.381046 MOO Available 57603