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Characterization of Integrated Circuit Packaging Materials

Moore, Thomas M.

Characterization of Integrated Circuit Packaging Materials - Boston : Butterworth-Heinemann, c1993 - XVIII, 274 p. - Materials Characterization Series .

ISBN: 0750692677

ISSN:

Subjects--Topical Terms:
Electronic Packaging Materials
Integrated Circuits Design and Construction

Dewey Class. No.: 621.381046 / MOO

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