Study and Improvement of Electrical Performance of 130 Nm Cu/Cvd Low K Sioch Interconnect Related to Via Etch Procedd (Record no. 760174)

MARC details
000 -LEADER
fixed length control field 00503nab a2200145Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2003 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Tsang, C F
9 (RLIN) 806736
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Su, Y J
9 (RLIN) 806737
245 #0 - TITLE STATEMENT
Title Study and Improvement of Electrical Performance of 130 Nm Cu/Cvd Low K Sioch Interconnect Related to Via Etch Procedd
300 ## - PHYSICAL DESCRIPTION
Extent 1051-1058 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Failure Analysis
9 (RLIN) 173017
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Copper Interconnects
9 (RLIN) 806739
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2003
Title Microelectronics Journal
International Standard Serial Number 00262692
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.34, No.11 (Nov. 2003)   19/08/2023 Articles