Study and Improvement of Electrical Performance of 130 Nm Cu/Cvd Low K Sioch Interconnect Related to Via Etch Procedd
Tsang, C F Su, Y J
Study and Improvement of Electrical Performance of 130 Nm Cu/Cvd Low K Sioch Interconnect Related to Via Etch Procedd - 1051-1058 p.
Failure Analysis
Copper Interconnects
Study and Improvement of Electrical Performance of 130 Nm Cu/Cvd Low K Sioch Interconnect Related to Via Etch Procedd - 1051-1058 p.
Failure Analysis
Copper Interconnects