Microde for mation Analysis of Packages and Interconnects to Improve Finite Element Models for Reliability Assessments (Record no. 758255)

MARC details
000 -LEADER
fixed length control field 00588nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2003 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Kaulfersch, Eberhard
9 (RLIN) 804247
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Vogel, Dietmar
9 (RLIN) 804248
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Michel, Bernd
9 (RLIN) 770322
245 #0 - TITLE STATEMENT
Title Microde for mation Analysis of Packages and Interconnects to Improve Finite Element Models for Reliability Assessments
300 ## - PHYSICAL DESCRIPTION
Extent 239-244 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Csp
9 (RLIN) 733340
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Fea
9 (RLIN) 711448
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Cte
9 (RLIN) 804249
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2003
Title Ieee Transactions onElectronics Packaging Manufacturing
International Standard Serial Number 1523334X
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.26, No.03 (Jul. 2003)   19/08/2023 Articles
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