Microde for mation Analysis of Packages and Interconnects to Improve Finite Element Models for Reliability Assessments (Record no. 758255)
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000 -LEADER | |
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fixed length control field | 00588nab a2200169Ia 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 230808s2003 |||||||f |||| 00| 0 eng d |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Kaulfersch, Eberhard |
9 (RLIN) | 804247 |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Vogel, Dietmar |
9 (RLIN) | 804248 |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Michel, Bernd |
9 (RLIN) | 770322 |
245 #0 - TITLE STATEMENT | |
Title | Microde for mation Analysis of Packages and Interconnects to Improve Finite Element Models for Reliability Assessments |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 239-244 p. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Csp |
9 (RLIN) | 733340 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Fea |
9 (RLIN) | 711448 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Cte |
9 (RLIN) | 804249 |
773 ## - HOST ITEM ENTRY | |
Place, publisher, and date of publication | 2003 |
Title | Ieee Transactions onElectronics Packaging Manufacturing |
International Standard Serial Number | 1523334X |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Articles |
-- | 51 |
-- | ABUL KALAM Library |
Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
---|---|---|---|---|---|
Engr Abul Kalam Library | Vol.26, No.03 (Jul. 2003) | 19/08/2023 | Articles |