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Microde for mation Analysis of Packages and Interconnects to Improve Finite Element Models for Reliability Assessments

Kaulfersch, Eberhard Vogel, Dietmar Michel, Bernd

Microde for mation Analysis of Packages and Interconnects to Improve Finite Element Models for Reliability Assessments - 239-244 p.

Subjects--Topical Terms:
Csp
Fea
Cte

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