Simulation of Degradation of Dielectric Breakdown Field of Thermal Sio2 Films Due to Voids Si Wafers (Record no. 745490)

MARC details
000 -LEADER
fixed length control field 00574nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2000 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Satoh, Yuhki
9 (RLIN) 781074
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Shiota, Takaaki
9 (RLIN) 781075
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Furuya, Hisashi
9 (RLIN) 781077
245 #0 - TITLE STATEMENT
Title Simulation of Degradation of Dielectric Breakdown Field of Thermal Sio2 Films Due to Voids Si Wafers
300 ## - PHYSICAL DESCRIPTION
Extent 398-304 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Crystal Growth
9 (RLIN) 95418
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Dielectric Breakdown
9 (RLIN) 742641
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Voids
9 (RLIN) 174888
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2000
Title IEEE Transactions on Electron Devices
International Standard Serial Number 00189383
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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  Engr Abul Kalam Library Vol.47, No.02 (Feb. 2000)   19/08/2023 Articles
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