Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications (Record no. 740207)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 00572nab a2200169Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s2001 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Zhang, Z |
| 9 (RLIN) | 753718 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Shi, S. H. |
| 9 (RLIN) | 768080 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Wong, C. P. |
| 9 (RLIN) | 93201 |
| 245 #0 - TITLE STATEMENT | |
| Title | Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 59-66 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Epoxy Resin |
| 9 (RLIN) | 170487 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Flip Chip |
| 9 (RLIN) | 765290 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Lead-Free Solder |
| 9 (RLIN) | 756437 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 2001 |
| Title | IEEE Transactions on Components and Packaging Technologies |
| International Standard Serial Number | 15213331 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.24, No.01 (Mar. 2001) | 19/08/2023 | Articles |