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Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications

Zhang, Z Shi, S. H. Wong, C. P.

Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications - 59-66 p.

Subjects--Topical Terms:
Epoxy Resin
Flip Chip
Lead-Free Solder

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