Study on Effect of Coupling Agents on Underfili Material in Flip Chip Packaging (Record no. 740204)

MARC details
000 -LEADER
fixed length control field 00510nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2001 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Luo, Shijian
9 (RLIN) 768075
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Wong, C. P.
9 (RLIN) 93201
245 #0 - TITLE STATEMENT
Title Study on Effect of Coupling Agents on Underfili Material in Flip Chip Packaging
300 ## - PHYSICAL DESCRIPTION
Extent 38-42 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Adhesion
9 (RLIN) 51632
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Coupling
9 (RLIN) 768076
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Silane
9 (RLIN) 174408
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2001
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.24, No.01 (Mar. 2001)   19/08/2023 Articles
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