Study on Effect of Coupling Agents on Underfili Material in Flip Chip Packaging
Luo, Shijian Wong, C. P.
Study on Effect of Coupling Agents on Underfili Material in Flip Chip Packaging - 38-42 p.
Adhesion
Coupling
Silane
Study on Effect of Coupling Agents on Underfili Material in Flip Chip Packaging - 38-42 p.
Adhesion
Coupling
Silane