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Rigorous Electromagnetic Modeling of Chip-To-Package First-Level Interconnections

Tsuei, Y. G Cangeliaris, andreas C. Prince, John L.

Rigorous Electromagnetic Modeling of Chip-To-Package First-Level Interconnections - 876-883 p.

Subjects--Topical Terms:
Rigorous Dynamic Model
Modeling
Chip-To-Chip Interconnects

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