000 00463nab a2200121Ia 4500
008 230808s2002 |||||||f |||| 00| 0 eng d
100 _aLau, K. K
_9810681
245 0 _aCharacteristics and Reliabity of Fast-Flow, Snap-Cure, and Reworkable Underfills for Solder Bumped Flip Chip on Low-Cost Sustrates
300 _a231-239 p.
650 _aReliability
_953955
773 _d2002
_tIeee Transactions onElectronics Packaging Manufacturing
_x1523334X
942 _cART
_o51
_pABUL KALAM Library
999 _c771937
_d771937