000 | 00463nab a2200121Ia 4500 | ||
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008 | 230808s2002 |||||||f |||| 00| 0 eng d | ||
100 |
_aLau, K. K _9810681 |
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245 | 0 | _aCharacteristics and Reliabity of Fast-Flow, Snap-Cure, and Reworkable Underfills for Solder Bumped Flip Chip on Low-Cost Sustrates | |
300 | _a231-239 p. | ||
650 |
_aReliability _953955 |
||
773 |
_d2002 _tIeee Transactions onElectronics Packaging Manufacturing _x1523334X |
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942 |
_cART _o51 _pABUL KALAM Library |
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999 |
_c771937 _d771937 |