000 00503nab a2200145Ia 4500
008 230808s2003 |||||||f |||| 00| 0 eng d
100 _aTsang, C F
_9806736
100 _aSu, Y J
_9806737
245 0 _aStudy and Improvement of Electrical Performance of 130 Nm Cu/Cvd Low K Sioch Interconnect Related to Via Etch Procedd
300 _a1051-1058 p.
650 _aFailure Analysis
_9173017
650 _aCopper Interconnects
_9806739
773 _d2003
_tMicroelectronics Journal
_x00262692
942 _cART
_o51
_pABUL KALAM Library
999 _c760174
_d760174