| 000 | 00551nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s2003 |||||||f |||| 00| 0 eng d | ||
| 100 | _aLuo, Shijian | ||
| 100 |
_aWong, C. P. _993201 |
||
| 245 | 0 | _aSurface Property of Passivation Layer on Integrated Circuit Chip and Solder Mask Layer on Printed Circuit Board | |
| 300 | _a345-351 p. | ||
| 650 |
_aContact Angle _9325116 |
||
| 650 |
_aPassivation _9678798 |
||
| 650 |
_aSurface Tension _9325121 |
||
| 773 |
_d2003 _tIeee Transactions onElectronics Packaging Manufacturing _x1523334X |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c758266 _d758266 |
||