| 000 | 00571nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1992 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aMahoney, Leonard J. _9791846 |
||
| 100 |
_aChen, Chang-Lee _9791847 |
||
| 100 |
_aTsang, Dean Z. _9791849 |
||
| 245 | 0 | _aBond Wireless Multichip Packaging Technology for High-Speed Circuits | |
| 300 | _a451-456 p. | ||
| 650 |
_aWireless _992193 |
||
| 650 |
_aBond _9169281 |
||
| 650 |
_aMultichip Package _9788748 |
||
| 773 |
_d1992 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c750424 _d750424 |
||