| 000 | 00606nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1992 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aMaster, Raj N. _9789119 |
||
| 100 |
_aBeckham, Keith F. _9791821 |
||
| 100 |
_aRay, Sudipta K. _9791823 |
||
| 245 | 0 | _aDevice Interconnection Technology for Advanced Thermal Conduction Modules | |
| 300 | _a432-437 p. | ||
| 650 |
_aInterconnection Technologies _9779556 |
||
| 650 |
_aThermal Conduction Modules _9788283 |
||
| 650 |
_aDevice _9771204 |
||
| 773 |
_d1992 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c750415 _d750415 |
||