| 000 | 00590nab a2200157Ia 4500 | ||
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| 008 | 230808s1992 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aTummala, Rao R. _993811 |
||
| 100 |
_aAhmed, Shakil _9694283 |
||
| 245 | 0 | _aOverview of Packaging for Ibm Enterprise System/9000 Based onGlass-Ceramic Copper/Thin Film Thermal Conduction Module | |
| 300 | _a426-431 p. | ||
| 650 |
_aGlass Ceramics _952308 |
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| 650 |
_aCopper _9163065 |
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| 650 |
_aThermal Conduction Modules _9788283 |
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| 773 |
_d1992 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
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| 942 |
_cART _o51 _pABUL KALAM Library |
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| 999 |
_c750413 _d750413 |
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