| 000 | 00609nab a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1992 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aHayashi, Tsuyoshi _9791274 |
||
| 100 |
_aKatsura, Kohsuke _9791276 |
||
| 100 |
_aTsunetsugu, Hideki _9776583 |
||
| 245 | 2 | _aA New Packaging Technology Using Micro-Solder Bumps for High-Speed Photoreceivers | |
| 300 | _a578-582 p. | ||
| 650 |
_aPackaging Technology _9791278 |
||
| 650 |
_aBumps _9778660 |
||
| 650 |
_aHigh-Speed Photoreceivers _9791281 |
||
| 773 |
_d1992 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c750114 _d750114 |
||