| 000 | 00568nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1990 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aChanchani, Rajen _9790101 |
||
| 100 |
_aHali, Peter M. _9790102 |
||
| 245 | 0 | _aTemperature Dependence of Thermal Expansion of Ceramics and Metals for Electronic Packages | |
| 300 | _a743-750 p. | ||
| 650 |
_aTemperature Dependence _9174096 |
||
| 650 |
_aThermal Expansion _9726096 |
||
| 650 |
_aCeramics _944307 |
||
| 773 |
_d1990 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c749557 _d749557 |
||