000 00541nab a2200145Ia 4500
008 230808s1991 |||||||f |||| 00| 0 eng d
100 _aPendse, Rajendra D.
_9789664
245 2 _aA Comprehensive Approach for Analysis of Package Induced Stress in Ic'S Using Analytical and Empirical Methods
300 _a870-873 p.
650 _aFem Model
_9789666
650 _aIc Packages
_9771484
650 _aEmpirical Models
_9172599
773 _d1991
_tIEEE Transactions on Components Hybrids and Manufacturing Technology
_x01486411
942 _cART
_o51
_pABUL KALAM Library
999 _c749374
_d749374