000 | 00628nab a2200181Ia 4500 | ||
---|---|---|---|
008 | 230808s1992 |||||||f |||| 00| 0 eng d | ||
100 |
_aGoodling, John S. _9788482 |
||
100 | _aJaeger, Richard C. | ||
100 |
_aGoyal, A. _9786149 |
||
100 |
_aBhavnani, Sushil H. _9770540 |
||
245 | 0 | _aRe-Entrant Cavity Surface Enhancements for Immersion Cooling of Silicon Multichip Packages | |
300 | _a815-822 p. | ||
650 |
_aRe-Entrant Flows _9754962 |
||
650 |
_aCavity _9694212 |
||
650 |
_aImmersion _9710362 |
||
773 |
_d1992 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
942 |
_cART _o51 _pABUL KALAM Library |
||
999 |
_c748812 _d748812 |