| 000 | 00550nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1993 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aGanesan, Gams S. _9788693 |
||
| 100 |
_aBerg, Howard M. _9788695 |
||
| 245 | 0 | _aModel and Analyses for Solder Reflow Cracking Phenomenon in Smt Plastic Packages | |
| 300 | _a940-948 p. | ||
| 650 |
_aModel and Analysis _9780158 |
||
| 650 |
_aSmt _9788697 |
||
| 650 |
_aPackage Modeling _9767703 |
||
| 773 |
_d1993 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c748800 _d748800 |
||