000 | 00610nab a2200169Ia 4500 | ||
---|---|---|---|
008 | 230808s1993 |||||||f |||| 00| 0 eng d | ||
100 |
_aTsuei, Y. G _9788651 |
||
100 |
_aCangeliaris, andreas C. _9777364 |
||
100 |
_aPrince, John L. _9777362 |
||
245 | 0 | _aRigorous Electromagnetic Modeling of Chip-To-Package First-Level Interconnections | |
300 | _a876-883 p. | ||
650 |
_aRigorous Dynamic Model _9788654 |
||
650 |
_aModeling _915553 |
||
650 |
_aChip-To-Chip Interconnects _9760790 |
||
773 |
_d1993 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
942 |
_cART _o51 _pABUL KALAM Library |
||
999 |
_c748778 _d748778 |