000 00610nab a2200169Ia 4500
008 230808s1993 |||||||f |||| 00| 0 eng d
100 _aTsuei, Y. G
_9788651
100 _aCangeliaris, andreas C.
_9777364
100 _aPrince, John L.
_9777362
245 0 _aRigorous Electromagnetic Modeling of Chip-To-Package First-Level Interconnections
300 _a876-883 p.
650 _aRigorous Dynamic Model
_9788654
650 _aModeling
_915553
650 _aChip-To-Chip Interconnects
_9760790
773 _d1993
_tIEEE Transactions on Components Hybrids and Manufacturing Technology
_x01486411
942 _cART
_o51
_pABUL KALAM Library
999 _c748778
_d748778