| 000 | 00546nab a2200157Ia 4500 | ||
|---|---|---|---|
| 008 | 230808s1990 |||||||f |||| 00| 0 eng d | ||
| 100 |
_aIwase, Nobuo _9788594 |
||
| 100 |
_aTsuge, Akihiko _9718488 |
||
| 245 | 0 | _aHigh Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages | |
| 300 | _a313-319 p. | ||
| 650 | _aThermal Conductivity | ||
| 650 |
_aAluminum Nitride _9738735 |
||
| 650 |
_aCeramic Substrates _9788598 |
||
| 773 |
_d1990 _tIEEE Transactions on Components Hybrids and Manufacturing Technology _x01486411 |
||
| 942 |
_cART _o51 _pABUL KALAM Library |
||
| 999 |
_c748740 _d748740 |
||